Comparison ledger
Heller 1088, YES 6-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1088Heller | 6-2P-CPYES |
|---|---|---|
| OEM | Heller | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Heller 1088 | YES 6-2P-CP |
| Cited variants | — | |
| Specifications | ||
| Heating Zones | 8 zones (4 top and 4 below) plus 1 cooling zone[2] | — |
| Heating Method | Forced convection[2] | — |
| Conveyor Width | 18 inches (45 cm)[2] | — |
| Heated Length | 43.5 inches (111 cm)[2] | — |
| Overall Length | 96 inches (244 cm)[2] | — |
| Height | 50 inches (127 cm)[2] | — |
| Net Weight | 900 lbs (409 kg)[2] | — |
| Thermal Profiler | Included[2] | — |
| Oven Top | Counter balance for easy access to conveyor[2] | — |
| Solder Compatibility | Lead-free and leaded soldering[2] | — |
| Series | — | PB Series (manual load)[3] |
| Model | — | 6-2P-CP[1] |
| Wafer size | — | 150 mm wafers[1] |
| Process type | — | high temperature cure oven[3] |
| Operation | — | manual load[3] |
| Atmosphere/process control | — | dry inert atmosphere, pressure control, uniform temperature distribution, control of heating and cooling rates[3] |
| Cooling package | — | air only, no water[3] |
| Airflow | — | vertical laminar airflow[3] |
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