Waferpedia

Comparison ledger

1088versus1809 MK III SMT

Heller 1088, Heller 1809 MK III SMT, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1088Heller
OEMHellerHeller
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHeller 1088Heller 1809
Specifications
Heating Zones8 zones (4 top and 4 below) plus 1 cooling zone[1]—
Heating MethodForced convection[1]—
Conveyor Width18 inches (45 cm)[1]—
Heated Length43.5 inches (111 cm)[1]—
Overall Length96 inches (244 cm)[1]—
Height50 inches (127 cm)[1]—
Net Weight900 lbs (409 kg)[1]—
Thermal ProfilerIncluded[1]—
Oven TopCounter balance for easy access to conveyor[1]—
Solder CompatibilityLead-free and leaded soldering[1]—
Configuration—50/60 Hz[2]
Voltage—220V[2]
Make—Heller[2]
Model—1809 MK III[2]
Product type—SMT Reflow Oven[2]
Heating zones—9 heating zones (top and bottom, forced convection)[4]
Cooling zones—2[4]
Heated tunnel length—105 cm (254 cm)[4]
Large PCB width—20 cm (50.8 cm)[4]
Power input—3 phase, standard 480 volts[4]
Frequency—50/60 Hz[2]
Typical net weight—4350 lbs. (1970 kg)[4]
Temperature range—60-350 C standard[4]
Maximum temperature—Up to 450 C[4]
Temperature control accuracy—+/- 0.1 C[4]
Cross-belt temperature tolerance—+/- 2.0 C[4]
Heater wattage per zone—6000 W[4]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]smtdevices.comsmtdevices.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]efsmt.comefsmt.com