Comparison ledger
Finetech Sigma, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SigmaFinetech | 10100West Bond |
|---|---|---|
| OEM | Finetech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Finetech Sigma | West Bond 10100 |
| Specifications | ||
| FPXvision | High resolution magnification[1] | — |
| Placement accuracy | Sub-micron (0.5 µm on 300 mm wafer)[1] | — |
| Substrate size | Up to 300 mm[1] | — |
| Bonding force range | 0.2 to 1000 N (up to 1000 N)[2] | — |
| Working area | 450 x 150 mm[3] | — |
| Vacuum chamber pressure (option) | 10^-3 hPa[2] | — |
| Year of introduction (European premiere at Expoelectronica) | 2016[2] | — |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →