Comparison ledger
EV Group 520 IS Wafer, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 520 IS WaferEV Group | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | EV Group | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Manual wafer load substrate bonder | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 520 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | Refurbished[1] | — |
| Wafer size | Manual wafer load substrate bonder[2] | — |
| Max Bond Force | 60 kN[2] | — |
| Top side heater | 550°C max. in 1°C steps[2] | — |
| Bottom side heater | 550°C max. in 1°C steps[2] | — |
| Temperature uniformity | ± 1,5 %[2] | — |
| OEM | EV Group[1] | — |
| Model | 520 IS Wafer[1] | — |
| Category | Packaging & Bonding[3] | — |
| Description | Manual wafer load substrate bonder[3] | — |
| Bonding capabilities | Capable of fusion compression bonding, thermal compression bonding, and optional anodic bonding[2] | — |
| Bond chamber | High-vacuum capable bond chamber[2] | — |
| Control software | Windows based control software and operation interface[2] | — |
| Top side heater max temperature | 550°C in 1°C steps[2] | — |
| Bottom side heater max temperature | 550°C in 1°C steps[2] | — |
| Included items | Chiller; turbo pump & controller; roughing pump; system computer, monitor, and keyboard[2] | — |
| Other stated features | Auto opening of bond tool cover; high-vacuum capable bond chamber; ideal for R&D and pilot production applications[2] | — |
| Vintage | 2008[2] | — |
| Wafer Size | — | 6 inch[4] |
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