Comparison ledger
EV Group 510 Wafer, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 510 WaferEV Group | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | EV Group | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Manual wafer load substrate bonder | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 510 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | Refurbished[1] | — |
| Wafer size | Manual wafer load substrate bonder[1] | — |
| Max Bond Force | 10 kN[1] | — |
| Top side heater | 550°C max. in 1°C steps[1] | — |
| Bottom side heater | 550°C max. in 1°C steps[1] | — |
| Temperature uniformity | ± 1,5 % Turbo pump and controller[1] | — |
| Manufacturer | EV Group[1] | — |
| Model | 510 Wafer[1] | — |
| Category | Packaging & Bonding[2] | — |
| Wafer handling | Manual wafer load substrate bonder[2] | — |
| Bonding capability | Fusion and thermal compression bonding[1] | — |
| Bond chamber | High-vacuum capable bond chamber[2] | — |
| Control software | Windows based control software and operation interface[1] | — |
| Turbo pump and controller | Included[1] | — |
| Roughing pump | Included[1] | — |
| System chiller | Included[1] | — |
| Load/unload tool | Included[1] | — |
| System computer, monitor, and keyboard | Included[1] | — |
| Vacuum | Standard: 0.1 mbar; optional: 1E-5 mbar[3] | — |
| Max temperature | 550 °C[3] | — |
| Loading chamber | Manual[3] | — |
| Max contact force | 10, 20, 60 kN[3] | — |
| Heater size | 150 mm, 200 mm[3] | — |
| Single chips processing | Yes[3] | — |
| Active water cooling | For bottom side[3] | — |
| Power supply for anodic bonding | Max voltage 2 kV; max current 50 mA[3] | — |
| Wafer Size | — | 6 inch[4] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →