Comparison ledger
Esec 2100 XP, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2100 XPEsec | 10490West Bond |
|---|---|---|
| OEM | Esec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | 2008– | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Esec 2100 | West Bond 10490 |
| Cited variants | — | |
| Specifications | ||
| Voltage | 240 V[3] | — |
| Configuration | 50/60 Hz[3] | — |
| Full Load Power | 2300 VA[3] | — |
| Bonding method | Epoxy[2] | — |
| Cycle time | 167 ms[2] | — |
| Bonding accuracy (3σ) | Down to 15 µm[2] | — |
| Placement precision | 5 µm (at 4 placements per second)[4] | — |
| Placement rate | 4 chips per second[4] | — |
| Wafer size | 4" to 12" (on 8" or 12" wafer frames)[2] | — |
| Die size range | 0.25 mm to 20 mm[2] | — |
| Leadframe size (length) | 90 mm to 300 mm[2] | — |
| Leadframe size (width) | 9 mm to 84 mm[2] | — |
| Frequency | 50/60 Hz[3] | — |
| Phase | Single phase[3] | — |
| Manufacturer | — | West Bond[5] |
| Model | — | 10490[5] |
| Description | — | Convertible bonder, wedge to ball[6] |
| Tool type | — | Convertible bonder[7] |
| Bonding modes | — | Wedge bonding and ball bonding[7] |
| Use | — | Wire bonding[7] |
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