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Comparison ledger

DGP 8761 DFM 2800versus12 Benchtop Lapping Polishing

Disco DGP 8761 DFM 2800, Lapmaster 12 Benchtop Lapping Polishing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMDiscoLapmaster
CategoryCMPCMP
Wafer sizeWafer Notch Visual Monitoring Alignment Option—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DGP 8761Lapmaster 12 Benchtop Lapping Polishing
Cited variants
  • DGP 8761 / DFM 2800[1]
—
Specifications
Configuration12 inch Kits[1]Ring lapper[8]
Phase3 phase[1]—
Full Load current72 A[1]—
Machine Main breaker Rating90 A[1]—
Ampere Rating of Largest Load33 A[1]—
Interrupt Capacity35 kA[1]—
Short Circuit Current Rating5000 A[1]—
Full load Amps40 A[1]—
Voltage200V +/-10%[1]—
Ampere Rating of Largest load25 A[1]—
MappingLoad FOUP Department (Carrier Wafer Slot and Insert Slash) with Mapping Perception[2]—
Cut Function2 functions : Batch Cut and Pre Cut 2 functions[2]—
Robot Pick Inline Dedicated(200 mm / 300 mm wafer dedicated)[4]—
Spinner Table200 mm / 300 mm Universal (Orientation Flat)[4]—
FOUP OpenerUnit 300 mm Wafer Dedicated (with 200 mm adapter)[4]—
Wafer Sizes8 inch, 12 inch[1]—
Spindle Configuration3 Axis Dry Polishing (DP) Type 2 - Z1 Grinder - Z2 Grinder - Z3 Polisher[1]—
DGP 8761 Power Frequency50/60 Hz[1]—
DGP 8761 Phase3 phase[1]—
DGP 8761 Full Load Current72 A[1]—
DGP 8761 Main Breaker Rating90 A[1]—
DGP 8761 Ampere Rating of Largest Load33 A[1]—
DGP 8761 Interrupt Capacity35 kA[1]—
DGP 8761 Short Circuit Current Rating5000 A[1]—
DFM 2800 Power Frequency50/60 Hz[1]—
DFM 2800 Full Load Amps40 A[1]—
DFM 2800 Phase3 phase[1]—
DFM 2800 Voltage200V +/-10%[1]—
DFM 2800 Main Breaker Rating50 A[1]—
DFM 2800 Ampere Rating of Largest Load25 A[1]—
Accessories AvailableAuto Label Printer, Dicing Tape Pre-Cut Unit[1]—
Cut FunctionsBatch Cut and Pre Cut; DBG, SDBG, Auto TTV function included[2]—
S-DBG SpecificationDISCO Positioning Table 300mm Acrylic, T-arm1 300mm Porous Type[2]—
Polishing Wheel SpecificationsApplicable GDP Polishing Wheel Specifications (Z3-axis)[2]—
Ionizer Units12ea specification (DISCO Pure 9ea + LOCAL 3ea)[2]—
Polishing Residence CollectorDISCO Dry Vacuum Cleaner[2]—
UPS System2 units[2]—
DTU15312 units[2]—
DFM2800 BG Tape UV Chamber OptionIncluded[2]—
Wafer Notch Visual Monitoring Alignment OptionIncluded[2]—
Attachment Table, Peeling Table Temperature OptionIncluded[2]—
Attachment Part, Peeling Part Duct Cleaning UnitIncluded[2]—
Wafer ID ORC Read OptionIncluded[2]—
Wafer ID Barcode Print OptionIncluded[2]—
S-DBG Specification (DISCOPositioning Table 300mm Acrylic, T-arm1 300mm Porous Type)[2]—
Wafer sizeWafer Notch Visual Monitoring Alignment Option[2]—
Make—Lapmaster[5]
Model—12[5]
Category—CMP[6]
Type/Application—Single sided[7]
Plate diameter—12 in[7]
No. of conditioning rings—3[8]
Base—Rigid, lightweight, cast aluminum base[8]
Standard RPM—60 RPM[8]
RPM range with variable speed drive—0-60[8]
Drive motor - lapper—0.5 HP[8]
Drive motor - polisher—0.75 HP[8]
Length—25 in[8]
Width—18 in[8]
Height—24 in[8]
Estimated shipping weight—240 lbs[8]
Approximate weight—135 lbs / 61 kg[9]
Approximate dimensions—24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[9]
Electrical system—Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[9]
Motor—1/3 hp / 0.25 kW motor with gear reducer[9]
Abrasive feed system—Designed for water or oil based lapping slurries[9]
Automatic cycle timer—Automatic digital cycle timer[9]
Ring configuration—Ring lapper[8]
Ring ID—4.25 inches[8]

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Sources (9)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]Equipment inventory listing
  6. [6]waferpedia.comwaferpedia.com
  7. [7]lapmaster-wolters.comlapmaster-wolters.com
  8. [8]catalog.lapmaster.comcatalog.lapmaster.com
  9. [9]lapmaster-wolters.comlapmaster-wolters.com