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Comparison ledger

DCS 1440 Wafer Cleaner Spinversus11600 SRD

Disco DCS 1440 Wafer Cleaner Spin, Semitool 11600 SRD, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
11600 SRDSemitool
OEMDiscoSemitool
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DCSSemitool 11600 SRD
Specifications
Configuration5 in. table[1]Ceramic[3]
Max. workpiece sizeΦ8 inch[2]—
Table RPM100 - 3000 min^-1[2]—
Setting time for cleaning/drying0 - 999 sec[2]—
Cleaning nozzle speed1 - 37.5 °/sec[2]—
Cleaning rangeΦ365 mm (up to 210 x 210 mm)[2]—
Cleaning pressure range2.3 - 11.8 MPa[2]—
Equipment dimensions (W×D×H)400 × 600 × 1220 mm[2]—
Dry massApprox. 124 kg[2]—
Voltage200-240 VAC[1]—
Frequency50/60 Hz[1]—
Table size5 in.[1]—
Arm configurationDouble arm[1]—
Wiring3 Wire + ground[1]—
Manufacturer—Semitool[3]
Model—11600 SRD[3]
Equipment type—Spin Rinse Dryer[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]disco.co.jpdisco.co.jp
  3. [3]inventory listing