Comparison ledger
Disco 3220, Takatori MWS-23N, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | MWS-23NTakatori |
|---|---|---|
| OEM | Disco | Takatori |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Takatori MWS-23N |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Product type | — | MWS (Multi Wire Saw)[3] |
| Equipment family | — | Advanced Materials Manufacturing Equipment[3] |
| Main materials capable of slicing | — | SiC, GaN, LT, LN, ALN, SiN, Ga2O3, Sapphire, Crystal, GaAs, GaP, InP, Neodymium magnet, Ceramics, Resin, Metal, Platinum, Silver, Gold and other hard brittle material[3] |
| Processing capabilities | — | Variable processing conditions such as a thin wire, a high wire tension, a fast wire running or an extra-long time slicing process[3] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →