Waferpedia

Comparison ledger

3220versusM27

Disco 3220, Logitech M27, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
M27Logitech
OEMDiscoLogitech
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Logitech M27
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Product type—Soluble oil coolant[3]
Use—Coolant for use with a Logitech APD1 or APD2 saw[4]
Type—Soluble oil coolant[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]web.archive.orgweb.archive.org
  4. [4]web.archive.orgweb.archive.org
  5. [5]web.archive.orgweb.archive.org