Comparison ledger
Disco 3220, Logitech CS30, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 3220Disco | CS30Logitech |
|---|---|---|
| OEM | Disco | Logitech |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 3220 | Logitech CS30 |
| Specifications | ||
| equipment type | dicing saw[1] | — |
| Workplace size | ø150 mm[2] | — |
| Spindle layout | Single[2] | — |
| Spindle output | 1.5 kW at 30,000 min-1[2] | — |
| Spindle max revolution speed | 40,000 min-1[2] | — |
| X-axis feed speed range | 0.1 – 500 mm/s[2] | — |
| Y-axis index step | 0.0001 mm[2] | — |
| Z-axis repeating accuracy | 0.001 mm[2] | — |
| Z-axis max blade size | ø58 mm[2] | — |
| Motor | — | 240/110V, 50/60Hz; 0.25kw belt drive[3] |
| Blade | — | 200mm diameter; 1.5mm thick; 22mm arbor; 1800 r.p.m[3] |
| Slide Size | — | 2 of 28 x 48mm/26 x 46mm or 1 of 26 x 76mm[3] |
| Dimensions | — | 530 x 240 x 300mm[3] |
| Net Weight | — | 30kg[3] |
| Blade diameter | — | 200mm[3] |
| Blade thickness | — | 1.5mm[3] |
| Blade arbor | — | 22mm[3] |
| Blade speed | — | 1800 r.p.m[3] |
| Slide size capacity | — | 2 of 28 x 48mm/26 x 46mm or 1 of 26 x 76mm[3] |
| Dimensions (W x D x H) | — | 530 x 240 x 300mm[3] |
| Minimum specimen thickness (trimming) | — | 500 µm[3] |
| Machine type | — | Compact trim saw[3] |
| Application | — | Thin section preparation[3] |
| Minimum trimming thickness | — | 500 µm[3] |
| Chuck | — | Ceramic vacuum chuck[3] |
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