Comparison ledger
Despatch 300mm-Ofen, Tokyo Electron NS300Z, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 300mm-OfenDespatch | NS300ZTokyo Electron |
|---|---|---|
| OEM | Despatch | Tokyo Electron |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Despatch 300mm-Ofen | Tokyo Electron NS300Z |
| Specifications | ||
| Automationsfunktion | Nimmt sowohl 200mm als auch 300mm-Scheiben auf.[1] | — |
| Werkzeugkapazität | 50 Scheiben mit Standard Zwei-Kammerkonfiguration; zusätzliche Kammern können angefügt werden.[1] | — |
| Thermische Prozesseigenschaften | Inertatmosphäre; 175°C Maximaltemperatur; Temperaturgleichmäßigkeit ±1.0°C bei 95°C Eintaucht temperatur; aktive Kühlung für schnelles Abkühlen; HEPA-Filter.[1] | — |
| Zusätzliche Eigenschaften | Erfüllt SEMI S2/S8 und SEMATECH Anhänge A, B und C; grafische Benutzer-Schnittstelle (GUI); erfüllt 300mm SEMI Kommunikationsstandards; FOUP ID-Leser; 2 Ebenen Überwachung; Scheiben-ID-Leser; nicht unterbrechbare Stromversorgung (UPS).[1] | — |
| Abmessungen | Etwa 262 cm Breite und 224 cm Länge.[1] | — |
| Automation function | Accepts both 200mm and 300mm wafers.[1] | — |
| Tool capacity | 50 wafers with standard two-chamber configuration; additional chambers can be added.[1] | — |
| Process atmosphere | Inert atmosphere.[1] | — |
| Maximum temperature | 175°C[1] | — |
| Temperature uniformity | ±1.0°C at 95°C immersion temperature.[1] | — |
| Cooling | Active cooling for rapid cool-down.[1] | — |
| Filter | HEPA filter.[1] | — |
| Additional features | Meets SEMI S2/S8 and SEMATECH Appendices A, B, and C; graphical user interface; meets 300mm SEMI communication standards; FOUP ID reader; 2-level monitoring; wafer ID reader; uninterruptible power supply (UPS).[1] | — |
| Dimensions | About 262 cm wide and 224 cm long.[2] | — |
| Wafer size | — | 300mm[3] |
| System type | — | Scrubber[3] |
| Tool type | — | Scrubber system[3] |
| Process modules | — | Process modules with proven reliability and stability[3] |
| Performance | — | Further productivity improvements[3] |
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