Waferpedia

Comparison ledger

03 iX AutomaticversusJX-100 LED

Dek 03 iX Automatic, Juki JX-100 LED, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMDekJuki
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDek 03 iX AutomaticJuki JX-100 LED
Specifications
Vintage2020[1]—
Board size—Min.50×50 ~ Max.360x800MM[2]
Component Size—Min. 0603mm(0201 Inch) ~ Max. □33.5mm[2]
Placement speed—15,300CPH[2]
Board size range—Min 50 mm × 50 mm to Max 800 mm × 360 mm (when sent through twice; when sent through once, maximum length is 410 mm × 360 mm)[3]
Component size range—Min 0603 mm (0201 inch) to Max □33.5 mm[3]
Component height—12.0 mm (becomes 9.0 mm when board’s X-directional length exceeds 630 mm)[3]
Placement speed (chip, optimized)—19,300 CPH[3]
Placement speed (IPC9850)—15,300 CPH[3]
Placement accuracy—±0.05 mm (±3σ)[3]
Component centering device—Laser centering (LNC60)[3]
Feeder inputs—Max 30 8mm tape feeders (60 with optional rear bank)[3]

Plan your fab

Building a Assembly / SMT process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]dealer listingwotol.com
  3. [3]juki.co.jpjuki.co.jp