Comparison ledger
CEE 1000 Hot Plate, YES PB6-2P-CP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PB6-2P-CPYES | |
|---|---|---|
| OEM | CEE | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | 5 in, 6 in, or 4 in wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 1000 Hot Plate | YES PB6-2P-CP |
| Specifications | ||
| Configuration | 4"[1] | — |
| Type | Hot Plate[1] | — |
| Wafer Size | 4 inch[1] | — |
| Model | — | YES-PB-6-2P-CP[2] |
| Product line | — | YES 450PB Bake Ovens[2] |
| Process type | — | High temperature vacuum bake/cure ovens for BCB/Polyimide[2] |
| Maximum operating temperature | — | Up to 450°C[2] |
| Wafer capacity | — | 2 cassettes of 5" or 6" wafers, or 3 cassettes of 4" wafers[2] |
| Chamber material | — | 316L SS[2] |
| Oven chamber size | — | 10.75 in ID x 22.2 in deep x 7.5 in H[2] |
| Controller | — | CTC controller with color touchscreen[2] |
| Control features | — | Multiple PIDs[2] |
| Uniformity at dwell | — | +1 / -3.5°C[2] |
| Recipes | — | Eight separate recipes with up to 16 ramps and dwells in each recipe[2] |
Plan your fab
Building a Thermal / Diffusion process? Get a complete equipment list.
Open the fab equipment planner →