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Comparison ledger

100versusMA 200 Compact Mask

CEE 100, SUSS MicroTec MA 200 Compact Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100CEE
MA 200 Compact MaskSUSS MicroTec
OEMCEESUSS MicroTec
CategoryLithographyLithography
Wafer size6"Wafer Handler
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCEE 100SUSS MicroTec MA 200
Cited variants—
Specifications
Tool typeSpray Developer[1]—
Accepts wafer sizeup to 6" wafers[2]—
Programmable programs10 programs[2]—
Steps per programup to 10 steps[2]—
Programmable step parametersAcceleration, Speed, Time[2]—
Associated documentCEE Model 100CB Spinner.doc[2]—
Wafer sizeUp to 6 inches[2]Wafer Handler[3]
Programs10 programs each with up to 10 steps[2]—
Control parametersAcceleration, Speed, Time[2]—
Phase—3 Phase +N +PE[3]
Configuration—50/60 Hz[3]
Voltage—400V[3]
Handler Type—Robot[3]
Gas—N2[3]
Power—400V[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.ece.cmu.edunanofab.ece.cmu.edu
  2. [2]nanofab.utah.edunanofab.utah.edu
  3. [3]inventory listing