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Comparison ledger

FPA 3030 i 5+ Fine Patternversus150 e Mask

Canon FPA 3030 i 5+ Fine Pattern, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
OEMCanonSUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCanon FPASUSS MicroTec 150 e Mask
Specifications
Configuration350 nm[1]—
MakeCanon[1]—
ModelFPA 3030 i 5+[1]—
TypeStepper[2]—
Technologyi-line (365nm)[2]—
Wafer Size200mm; 150mm[2]—
Resolution≤0.35μm[2]—
Numerical Aperture (NA)0.45 ~ 0.63[2]—
Reticle Size6in. (0.25in. thick); optional 5in.[2]—
Reduction Ratio5:1[2]—
Field Size22mm x 22mm[2]—
Overlay Accuracy≤40nm (|m|+3 )[2]—
Throughput≥104wph (200mm); ≥120wph (150mm)[2]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]downloads.canon.comdownloads.canon.com