Comparison ledger
Canon FPA 3000 i 5 + Fine Pattern, SUSS MicroTec MJB 4 Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | MJB 4 MaskSUSS MicroTec | |
|---|---|---|
| OEM | Canon | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Canon FPA 3000 | SUSS MicroTec MJB |
| Cited variants | — | |
| Specifications | ||
| Configuration | Main 1:[2] | Front side Alignment[4] |
| Phase | 3 Phase[2] | — |
| Wafer sizes supported | 6 inch[3] | — |
| Power supply main 1 | 3 Phase - 3 Wire - 50/60 Hz[2] | — |
| Power supply main 2 | 1 Phase - 2 Wire - 50/60 Hz[2] | — |
| Vintage | 1997[2] | — |
| Trinocular Split Field Microscope | — | Dual 5X & 10X Objectives[4] |
| OEM | — | SUSS MicroTec[5] |
| Model | — | MJB 4[6] |
| Exposure types | — | vacuum, hard, soft proximity contact[5] |
| Substrate size (max) | — | 4 inches in diameter[5] |
| Mask/substrate thickness capacity | — | 9.00 mm total[5] |
| Exposure optics | — | 400 nm[5] |
| Lamps | — | allowing sub-micron exposure in vacuum contact[5] |
| Photoresist tones | — | positive and negative[5] |
| Alignment type | — | topside only[5] |
| Minimum alignment mark separation (binocular) | — | 3.5 cm[5] |
| Typical pattern resolution | — | 1 µm[5] |
| Achievable alignment resolution | — | 1 µm[5] |
| Wafer sizes | — | 2, 3, 4, 12 inch[4] |
| Alignment features (as listed by reseller) | — | front side alignment; trinocular split field microscope with dual 5X & 10X objectives; video camera; high resolution alignment; Suss power supply[4] |
| Contact exposure modes | — | vacuum, hard, soft, proximity contact[5] |
| Substrate size | — | up to 4 inches in diameter[5] |
| Maximum mask and wafer total thickness | — | 9.00 mm[5] |
| Adjustment accuracy (X, Y, theta) | — | below 1 µm[5] |
| Exposure optics wavelength | — | 400 nm[5] |
| Topside alignment | — | yes[5] |
| Wafer sizes (listing) | — | 2, 3, 4, 12 inch[4] |
| Alignment type (listing) | — | Front side[4] |
| Microscope | — | Trinocular Split Field with Dual 5X & 10X Objectives[4] |
| Camera | — | Video Camera[4] |
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