Waferpedia

Comparison ledger

MetaServe 2000versus12 Lapper

Buehler MetaServe 2000, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
OEMBuehlerLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family——
Specifications
Outside plate diameter—12 inches[1]
Lapping Speed Range—0 to 60 rpm[2]
Wafer Size Compatibility—4 inches or smaller[1]
Input Voltage—110 V[1]
Frequency—60 Hz[1]
Phase—1[1]
Number of Rings—3[1]
Number of Weights—3[1]
Includes Slurry System—Yes[1]
Includes Timer—Yes[1]

Plan your fab

Building a CMP process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu