Waferpedia

Comparison ledger

017-0024-01 PrealignerversusMA200 Gen3

Brooks 017-0024-01 Prealigner, SUSS MicroTec MA200 Gen3, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MA200 Gen3SUSS MicroTec
OEMBrooksSUSS MicroTec
CategoryLithographyLithography
Wafer size—200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation—Gen3
FamilyBrooks 017-0024-01 PrealignerSUSS MicroTec MA200 Gen3
Specifications
Type—Automated system[1]
Wafer size—up to 200 mm[1]
Process—Mask Alignment, Exposure[1]
Substrate type—Wafers and square substrates[2]
Exposure modes—Proximity, contact, soft contact, hard contact, and vacuum contact exposure[3]
Top-side alignment accuracy—0.5 µm[2]
Minimum proximity resolution—3.5 µm[2]
Minimum vacuum contact resolution—<0.8 µm[2]
Handling capability—Fragile, warped, or ultra-thin wafers down to 50 µm[2]
Mask management—Integrated mask library stores and manages multiple photomasks[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]hilpert.chhilpert.ch
  2. [2]suss.comsuss.com
  3. [3]inseto.cominseto.com