Comparison ledger
Branson 101-149-053 Gold Booster, Finetech Fineplacer 96, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | Fineplacer 96Finetech |
|---|---|---|
| OEM | Branson | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Wafer Ring Holder, |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Branson 101-149-053 Gold Booster | Finetech Fineplacer 96 |
| Specifications | ||
| Configuration | 1:1.5[1] | Add On Option:[4] |
| Manufacturer | Branson[2] | — |
| Model | 101-149-053[2] | — |
| Type | Gold Booster[2] | — |
| Operating frequency | 20 kHz[3] | — |
| Gain | 1:1.5[2] | — |
| Mounting thread | 1/2-20[3] | — |
| Length | 5.4 in[3] | — |
| Gain ratio | 1:1.5[2] | — |
| Wafer size | — | Wafer Ring Holder,[5] |
| Tool type | — | Die bonder[5] |
| Category | — | Packaging & Bonding[5] |
| Optional modules | — | Flip Chip Module; Epoxy Dispenser Module; Pick & Place Module; UV Curing System; Heat Plate; Wafer Ring Holder; Accessories; Isolated Table[4] |
| Description | — | Manual FlipChip Bonder[6] |
| Available options | — | Die Attach; SMD; FLIP CHIP; UV Wafer Ring Release Module[6] |
| Bonding accuracy | — | 0.5 µm[6] |
| Max. die/package size | — | 16 mm (pick-n-place only)[6] |
| Min. die/package size | — | 0.5 mm[6] |
| Substrate size | — | 50 mm × 50 mm (thermal compression); 180 mm × 108 mm (pick-n-place only)[6] |
| Bonding environment | — | Nitrogen / formic acid[6] |
| Bonding mechanism | — | Thermo-compression; reflow; thermo-sonic[6] |
| Thermo-compression bonding force | — | 0.1 ~ 200 N[6] |
| Reflow temperature | — | RT ~ 400 °C[6] |
| Reflow heating rate | — | 20 °C/s[6] |
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