Comparison ledger
Blue M 0 500, Mattson 8800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0 500Blue M | 8800Mattson |
|---|---|---|
| OEM | Blue M | Mattson |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | 200mm |
| Process node | — | 0.25-micron |
| Introduced | — | 1997 |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 1997 Award recognition · 1997 Product award |
| Control system | — | — |
| Generation | — | third-generation |
| Family | Blue M 0 500 | Mattson 8800 |
| Specifications | ||
| Manufacturer | Blue M[1] | — |
| Model | 0 500[1] | — |
| Asset number | 139866[1] | — |
| Last confirm date | September 10, 2025[1] | — |
| Equipment type | Oven[1] | — |
| Tool type | — | Third-generation RTP tool[2] |
| Process target | — | 0.25-micron process requirements[2] |
| Wafer size | — | 200 mm[2] |
| Wafer format | — | Single-wafer[2] |
| Temperature performance | — | Improves temperature uniformity and repeatability[2] |
| Throughput | — | Significantly boosts throughput[2] |
| Ceramic Shield option | — | Backside emissivity independence and better wafer-to-wafer repeatability[2] |
| Nitrogen curtain | — | Minimum pre-purge time and high-throughput configuration[2] |
| High process purge gas flow | — | Fast chamber purging for high-throughput configuration[2] |
| ez-DTC | — | High-throughput configuration and improved control[2] |
| High temperature end effector | — | High-throughput configuration[2] |
| Double O-ring seal system | — | Prevents product loss[2] |
| Swivel cassettes with independent swivels | — | Higher throughput[2] |
| Standard slip-free ring package | — | High temperature slip-free processing and improved uniformity[2] |
| Certifications | — | CE certified and UL listed[2] |
| Generation | — | third-generation RTP tool[2] |
| Process node | — | 0.25-micron[2] |
| Award | — | Semiconductor International Editor's Choice Best Product Award (1997)[2] |
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