Comparison ledger
Besi DS 9000 E, Kulicke & Soffa Rapid Pro Automatic, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DS 9000 EBesi | Rapid Pro AutomaticKulicke & Soffa |
|---|---|---|
| OEM | Besi | Kulicke & Soffa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi DS 9000 E | Kulicke & Soffa Rapid Pro Automatic |
| Cited variants | — | |
| Specifications | ||
| Voltage | 208 VAC[4] | 200 / 220 / 240 VAC[6] |
| Configuration | Single Phase[1] | — |
| Phase | 1 Phase[5] | Single phase[6] |
| Make | Besi / Datacon[1] | — |
| Model | DS 9000 E[1] | Rapid Pro Automatic[6] |
| Tool type | Bonder[1] | — |
| Wafer size | 8 inch[1] | — |
| Frequency | 50/60 Hz[4] | 50/60 Hz[6] |
| Current | 10 Amps[4] | 15 A[6] |
| Power | — | Approx. 2.6 kVA[6] |
| Wire size (Au, Cu, Ag) | — | 0.6 to 2.5 mil[6] |
| Bond placement accuracy (3 sigma) | — | 2 µm[6] |
| Bonding area X | — | 56 mm[7] |
| Bonding area Y (standard) | — | 80 mm[2] |
| Bonding area Y (LA variant) | — | 87 mm[2] |
| Bonding area Y (ELA variant) | — | 80 mm[2] |
| Bonding method | — | Ball bonder[7] |
| Maximum wire length | — | 76 mm (with 1.0 mil wire)[2] |
| Minimum loop height | — | 40 µm (with 0.6 mil wire)[2] |
| Wire pitch | — | 35 µm[7] |
| Wire sway | — | 25 µm (wire length ≤ 2.54 mm)[7] |
| Power supply | — | 200-240 VAC, -15% to 10%, single phase, 50/60 Hz, 2.6 kVA[7] |
| Air consumption | — | 185 L/min[7] |
| Air pressure | — | 3.52 kg/cm²[7] |
| Net weight | — | 590 kg[7] |
| Dimensions (base machine with MHS) | — | 889 x 1003 mm[7] |
| Magazine dimensions | — | 305 x 110 x 178 mm[7] |
| Leadframe dimensions | — | 300 x 92 mm[7] |
| Same leadframe type conversion time | — | 4 min[7] |
| Different leadframe type conversion time | — | 8 min[7] |
| Die pad downset | — | Up to 2.3 mm[7] |
| Vision system | — | Higher resolution progressive scan, CCD camera + dual magnification (2x & 6x), optional programmable focus[2] |
| ROHS compliant | — | Yes[2] |
| Bonding Area (X x Y) | — | 56 x 80 mm[7] |
| Air Pressure | — | 3.52 kg/sq cm[7] |
| Bonding Wire Length | — | 7.6 mm[7] |
| Different Leadframe Type | — | 8 min (change time?)[7] |
| Gold Wire Size | — | 0.6 to 2.5 mil[7] |
| Minimum Loop Height | — | 40 µm[7] |
| Overall Dimensions (Base Machine with MHS) | — | x 889 x 1003 mm (first dimension not stated)[7] |
| Placement Accuracy | — | 2 µm[7] |
| Same Leadframe Type | — | 4 min (change time?)[7] |
| Wire Sway | — | 25 µm[7] |
| Power Consumption | — | Approx. 2.6 kVA[6] |
| Manufacturer | — | Kulicke & Soffa Industries, Inc.[7] |
| Type | — | Automatic wire bonder[6] |
| Material handling | — | Automatic magazine material handling[6] |
| Wire size | — | 0.6 to 2.5 mil Au, Cu, and Ag wire[6] |
| Placement accuracy | — | 2 um bond placement accuracy at 3 sigma[6] |
| Bonding area | — | 56 mm x 80 mm[7] |
| Vintage | — | 2020[6] |
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