Comparison ledger
Besi 2200 EVO, Finetech Lambda, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2200 EVOBesi | LambdaFinetech |
|---|---|---|
| OEM | Besi | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2200 | Finetech Lambda |
| Cited variants |
| |
| Specifications | ||
| Configuration | Dual Head[4] | 50 x 50 mm Heating Plate with Gel/Waffle Pack station[6] |
| Power supply | 3 x 400 v[5] | — |
| U nominal | 3 x 400 V[5] | — |
| X/Y placement accuracy | ±10 µm @ 3s[2] | — |
| Theta placement accuracy | ±0.15° @ 3s[2] | — |
| Bond force | 0.5N to 75N programmable[2] | — |
| Throughput (die attach) | up to 7,000 UPH/module[2] | — |
| Throughput (flip chip with dipping) | up to 2,500 UPH/module[2] | — |
| Throughput (flip chip without dipping) | up to 3,200 UPH/module[2] | — |
| Number of working heads | up to 4[2] | — |
| Die size (die attach) | 0.17 mm - 50 mm[2] | — |
| Die size (flip chip) | 0.5 mm - 50 mm[2] | — |
| Die thickness | >50 µm (thinner on request)[2] | — |
| Wafer size | 4" - 12" (SEMI M1)[2] | — |
| Substrate working range | 13" x 8" (325 mm x 200 mm)[2] | — |
| Machine dimensions (LxDxH) | 1,160 mm x 1,225 mm x 1,750 mm[2] | — |
| Weight | 1,300 kg[2] | — |
| Uptime | > 98 %[2] | — |
| Yield | > 99.95 %[2] | — |
| Heated bond head temperature | up to 450°C (optional)[2] | — |
| UV curing wavelengths | 365 nm & 405 nm[2] | — |
| UPH (Die attach) | up to 7,000 UPH/module[2] | — |
| UPH (Flip Chip with dipping) | up to 2,500 UPH/module[2] | — |
| UPH (Flip Chip without dipping) | up to 3,200 UPH/module[2] | — |
| Bond head rotation | 0° - 360°[2] | — |
| UV Curing | 365 nm & 405 nm[2] | — |
| Frame size | FF070, FF105, FF108, FF123; automatic change[2] | — |
| Head configuration | Dual Head[4] | — |
| Accuracy | — | 0.5 um[6] |
| Power | — | 80W Contact Chip Heater (CCH) with a single heated tool[6] |
| Placement Accuracy | — | 0.5 μm (sub-micron)[6] |
| Bond Force Range | — | 0.2-20 N[6] |
| Heating Plate Size | — | 50 × 50 mm[6] |
| Side Process Camera | — | Included[6] |
| Y Axis Camera Shifter | — | Included[6] |
| Fine Theta Adjustment on Bond Head | — | Included[6] |
| Dispense Syringe Mount Hardware | — | Included (no controller)[6] |
| Operating System | — | Windows 10 Pro[6] |
| Bonding Technologies | — | Thermocompression and ultrasonic[8] |
| Inert/Process Gas Enclosure | — | Included (on asset 153908)[7] |
| XY & Coplanarity Calibration Kit | — | Included (on asset 153908)[7] |
| Software | — | Finetech Software[6] |
| Placement Accuracy (description) | — | sub-micron[8] |
| Heating Plate | — | 50 x 50 mm with Gel/Waffle Pack station[6] |
| Control System | — | Windows 10 Pro PC[6] |
| Fine Theta Adjustment | — | Present on bond head[6] |
| Dispense Syringe Mount | — | Hardware only (no controller)[6] |
| Bond Line Adjust/Control Module | — | Present[6] |
| Contact Chip Heater | — | 80W (CCH) with single heated tool[7] |
| Substrate Heater (optional) | — | 100 x 100 mm with Gel/Waffle Pack station[6] |
| Placement accuracy | — | Sub-micron placement accuracy[8] |
| Bond technologies | — | Thermocompression and ultrasonic technologies[8] |
| Heating plate | — | 50 x 50 mm Heating Plate with Gel/Waffle Pack station[6] |
| Bond force range | — | 0.2-20N Bond Force Module[6] |
| Bond head theta adjustment | — | Fine Theta Adjustment on Bond Head[6] |
| Vision | — | Side Process Camera[6] |
| Camera shifter | — | Y Axis Camera Shifter[6] |
| Adhesive dispensing hardware | — | Dispense Syringe Mount Hardware – no controller[6] |
| Process gas enclosure | — | Inert/Process Gas Enclosure[7] |
| Contact chip heater | — | 80W Contact Chip Heater (CCH) with a single heated tool[7] |
| Calibration kit | — | XY & Coplanarity calibration kit[7] |
| Control PC | — | Windows 10 Pro PC, Keyboard, Mouse & Monitor[6] |
| Bond line control | — | Bond Line Adjust/Control Module[6] |
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