Waferpedia

Comparison ledger

200 PCUversusNV GSD HE

Axcelis 200 PCU, Sumitomo NV GSD HE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 PCUAxcelis
NV GSD HESumitomo
OEMAxcelisSumitomo
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2000 Vintage—
Control system——
Generation——
FamilyAxcelis NV GSD 200Sumitomo NV GSD HE
Cited variants
  • Fusion 200 PCU[1]
  • Fusion 200 PCU-P[2]
—
Specifications
P/NSC 4840 A[3]—
Frequency50 Hz[3]—
Phase3 Phase[3]—
Voltage400 V[3]—
Configuration—Disk Type:[4]
Wafer Titlt Function—α + β ≤ ±11° adjustable[4]
Manufacturer—Sumitomo[4]
Model—NV GSD HE[4]
Category—Ion Implantation[5]
Wafer size—6 inch[4]
Wafer handling—17 wafers[5]
Wafer tilt function—α + β ≤ ±11° adjustable[4]
Disk type—Full Disk; AL Solid Disk; 150 mm[4]
Available gas types—Ar (external supply); BF3 (SDS3 4X); Xe (3.4 L)[4]
Maximum injection energy—3,000 keV (varies depending on ion species)[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]exapro.comexapro.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com