Waferpedia

Comparison ledger

200 ACUversus1511e

Axcelis 200 ACU, Tegal 1511e, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
1511eTegal
OEMAxcelisTegal
CategoryEtchEtch
Wafer size—three- to six-inch wafers
Process node——
Introduced—1984
Production run—1984–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Tegal 1511e
Specifications
ConfigurationParts Machine[1]—
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
tool type—tri-electrode dual-frequency plasma etch system[5]
wafer size—three- to six-inch wafers[5]
first sold—1984[5]
system characteristic—first vacuum-loadlocked dual-frequency tri-electrode etch system[5]
First vacuum-loadlocked dual-frequency tri-electrode etch system—Yes[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]web.archive.orgweb.archive.org