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Comparison ledger

200 ACUversusMXP Multiplex ICP

Axcelis 200 ACU, STS MXP Multiplex ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
OEMAxcelisSTS
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200STS MXP Multiplex ICP
Specifications
ConfigurationParts Machine[1]Plasma Etcher[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]MXP Multiplex ICP[5]
Tool typeAsher[1]Inductively coupled plasma etcher[6]
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
OEM—STS[5]
Category—Etch[7]
Process—Plasma etching[6]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing
  6. [6]waferpedia.comwaferpedia.com
  7. [7]waferpedia.comwaferpedia.com