Waferpedia

Comparison ledger

200 ACUversusIonfab 300 Plus IBD IBE

Axcelis 200 ACU, Oxford Instruments Ionfab 300 Plus IBD IBE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 ACUAxcelis
Ionfab 300 Plus IBD IBEOxford Instruments
OEMAxcelisOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis NV GSD 200Oxford Instruments Ionfab 300
Specifications
ConfigurationParts Machine[1]Loadlock and robot with secondary pumping, Vacuum can remain inside for higher throughput.[5]
ManufacturerAxcelis[1]—
Model200 ACU[1]—
Tool typeAsher[1]—
Wafer size200mm[3]—
Serial numberAU6A356AH[3]—
Computer systemM 200 PC, M 200[4]—
Part numberSC 4572 A[4]—
Volts208[4]—
Amps30[4]—
Equipment typeAsher[1]—
Wafer configuration8 inch[2]—
Phase—3 Phase[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]wotol.comwotol.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]inventory listing