Waferpedia

Comparison ledger

Eagle XP 5versus10490

ASM Eagle XP 5, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMASMWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM EagleWest Bond 10490
Specifications
ConfigurationPE-ALD System Mainframe[1]—
Phase3 Phase[2]—
Full Load Amps130 A[2]—
MakeASM[1]—
ModelEagle XP 5[1]10490[4]
DescriptionBonder[1]Convertible bonder, wedge to ball[5]
PowerAC190-220V[2]—
Frequency50/60Hz[2]—
Current25 KA[1]—
Control & softwarewith PC & software[1]—
Software VersionEagle I ASMJ software (Windows embedded XP / OS)[3]—
Failure modeFaulty throttle valve in 2nd chamber[1]—
Vintage2010[1]—
Manufacturer—West Bond[4]
Tool type—Convertible bonder[6]
Bonding modes—Wedge bonding and ball bonding[6]
Use—Wire bonding[6]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing
  5. [5]fabsurplus.comfabsurplus.com
  6. [6]waferpedia.comwaferpedia.com