Comparison ledger
ASM AD 838, ASM Siplace CA 4 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AD 838ASM | |
|---|---|---|
| OEM | ASM | ASM |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 8" | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM AD 838 | ASM Siplace |
| Specifications | ||
| Wafer size | 8" wafer table[1] | 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion[3] |
| Configuration | Epoxy dispensing[1] | High Volume Chip Assembly[3] |
| Phase | 1 Phase[2] | — |
| Voltage | 220 Vac[2] | — |
| Tool function | Die bonder[2] | — |
| Wafer table size | 8 inches[1] | — |
| Epoxy dispensing | Yes[1] | — |
| Stack input | No[1] | — |
| Electrical supply phases | 1 phase[2] | — |
| Supply voltage | 220 Vac[2] | — |
| Supply frequency | 50/60 Hz[2] | — |
| Manufacturer | — | ASM[3] |
| Model | — | Siplace CA 4 Wafer[3] |
| Category | — | Packaging & Bonding[4] |
| Assembly type | — | High Volume Chip Assembly[3] |
| Wafer systems | — | 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion[3] |
| Wafer transfer systems | — | 4 Wafer Transfer Systems[3] |
| Camera and bonding head | — | 4 LP-Kamera (TYP34) and bonding Head C+P20[3] |
| Vacuum tooling | — | Single Transport Chuck[3] |
| Cooling system | — | Chiller Cooling System[3] |
| Vacuum pump | — | X-Series[3] |
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