Waferpedia

Comparison ledger

P 5000 Mark II Dielectricversus200 ACU

Applied Materials P 5000 Mark II Dielectric, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
P 5000 Mark II DielectricApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials P 5000 Mark IIAxcelis NV GSD 200
Specifications
ConfigurationMxP+[1]Parts Machine[3]
OEMApplied Materials[1]—
ModelP 5000 Mark II[1]200 ACU[3]
Tool typeDielectric Etch[1]Asher[3]
Wafer size6 inch[1]200mm[5]
Manufacturer—Axcelis[3]
Serial number—AU6A356AH[5]
Computer system—M 200 PC, M 200[6]
Part number—SC 4572 A[6]
Volts—208[6]
Amps—30[6]
Equipment type—Asher[3]
Wafer configuration—8 inch[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com