Waferpedia

Comparison ledger

Centura DT Hart Oxideversus200 ACU

Applied Materials Centura DT Hart Oxide, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura DT Hart OxideApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Centura DT Hart OxideAxcelis NV GSD 200
Specifications
Asset number82294[1]—
Vintage2002[1]—
Configuration—Parts Machine[2]
Manufacturer—Axcelis[2]
Model—200 ACU[2]
Tool type—Asher[2]
Wafer size—200mm[4]
Serial number—AU6A356AH[4]
Computer system—M 200 PC, M 200[5]
Part number—SC 4572 A[5]
Volts—208[5]
Amps—30[5]
Equipment type—Asher[2]
Wafer configuration—8 inch[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]wotol.comwotol.com
  5. [5]semistarcorp.comsemistarcorp.com