Comparison ledger
Applied Materials 0242-36515 RTP XE Chamber Temperature Match Kit, Despatch LCD1-16NV-3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0242-36515 RTP XE Chamber Temperature Match KitApplied Materials | LCD1-16NV-3Despatch |
|---|---|---|
| OEM | Applied Materials | Despatch |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Despatch LCD1-16NV-3 |
| Specifications | ||
| Equipment type | — | oven for polymer curing[1] |
| Intended use | — | Only for biocompatible devices[1] |
| Wafer carriers | — | 100mm and 150mm wafers[1] |
| Piece parts | — | allowed[1] |
| Atmosphere | — | nitrogen circulation[1] |
| Filter | — | high efficiency particulate air filter[1] |
| Temperature monitoring | — | possibility to monitor temperature[1] |
| Maximum temperature | — | 350°C[1] |
| Location | — | Zone 11[1] |
| Wafer sizes supported | — | 100mm, 150mm[1] |
| Piece parts allowed | — | Yes[1] |
| Nitrogen circulation | — | Yes[1] |
| High efficiency particulate air filter | — | Yes[1] |
| Usage restriction | — | Biocompatible devices only[1] |
Plan your fab
Building a Thermal / Diffusion process? Get a complete equipment list.
Open the fab equipment planner →