Comparison ledger
Applied Materials 0041-39086 ESC Part, Lam Research AutoEtch 590 plasma etcher plasma etch semiconductor, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-39086 ESC PartApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Lam Research AutoEtch 590 plasma etcher plasma etch semiconductor |
| Specifications | ||
| Model | — | Lam AutoEtch 590[1] |
| Category | — | Plasma Etch[1] |
| Original Equipment Manufacturer | — | Lam Research[1] |
| Condition | — | AS IS condition(No chiller, no pump, With ENI OEM 12 RF Generator)[1] |
| Wafer Size | — | 4,5,6 inch capability.[1] |
| Valid Time | — | Subject to prior sale[1] |
| Lead Time | — | Ready to go[1] |
| Warranty | — | No.[1] |
| Refund | — | No.[1] |
| Inspection | — | Against appointment[1] |
| Wafer size | — | Lam AutoEtch 590 Wafer Belt Drive System[1] |
| Wafer Size Capability | — | 4,5,6 inch[1] |
| Wafer Size Configuration | — | 4 and 6 inch configuration without hardware change[2] |
| Wafer Handling | — | In-line cassette to cassette, fully automated, single wafer[1] |
| Chamber Type | — | Double air-locked, parallel plate[1] |
| RF Generator | — | ENI OEM 12[1] |
| Display | — | CRT monitor display[1] |
| Control | — | Automatic, closed-loop feedback control, double keylocked[1] |
| Gas Panel Capacity | — | Five gases independently, actual capacity six gases (two may share fifth flow controller)[1] |
| OEM | — | Lam Research[1] |
| Wafer size capability | — | 4, 5, 6 inch capability[1] |
| Process type | — | single wafer[1] |
| Automation | — | fully automated[1] |
| Wafer handling | — | cassette-to-cassette[1] |
| Chamber structure | — | double air-locked[1] |
| Plasma configuration | — | parallel plate[1] |
| Process parameters | — | RF power, chamber pressure, gas flow control, electrode spacing, and multi-step process recipes[3] |
| Control architecture | — | automatic, closed-loop feedback control[1] |
| Interlock | — | double keylocked[1] |
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