Waferpedia

Comparison ledger

0041-26723 Bonded Assemblyversus8028

Applied Materials 0041-26723 Bonded Assembly, Kulicke & Soffa 8028, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
8028Kulicke & Soffa
OEMApplied MaterialsKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyKulicke & Soffa 8028
Cited variants—
Specifications
Type—Wire ball bonder[3]
Configuration—High speed fine pitch[3]
Voltage—220V[2]
Current—14A[2]
Manufacturer—Kulicke & Soffa[1]
Model—8028[4]
Category—Packaging & Bonding[1]
Tool type—wire ball bonder[2]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]spwindustrial.comspwindustrial.com
  3. [3]semistarcorp.comsemistarcorp.com
  4. [4]Equipment inventory listing