Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Besi 2200 APM Die Attach Flip Chip, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Besi 2200 |
| Specifications | ||
| Configuration | — | Vacuum plate[1] |
| Manufacturer | — | Besi / Datacon[1] |
| Model | — | 2200 APM[1] |
| Machine type | — | Die attach / flip chip machine[2] |
| Vacuum & pumping | — | Vacuum plate[2] |
| Wafer handling | — | 12" wafer handling[3] |
| Integrated dispenser | — | Integrated dispenser[3] |
| Tooling | — | Automatic tool changer[3] |
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