Waferpedia

Comparison ledger

0020 23839 PartversusIon Beam

Applied Materials 0020 23839 Part, Oxford Instruments Ion Beam, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
Ion BeamOxford Instruments
OEMApplied MaterialsOxford Instruments
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartOxford Instruments Ion Beam
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]DC Hot Wire Filament Ion-Guns[2]
Ion source type—DC hot wire filament[2]
Substrate motion—Planetary system[2]
Thickness monitoring—Quartz crystal microbalance (QCM)[2]
Substrate handling—Planetary system[2]
Film thickness monitoring—QCM for layer thickness[2]
Thickness Monitoring—QCM (Quartz Crystal Microbalance)[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing