Waferpedia

Comparison ledger

0020 18455 Partversus790

Applied Materials 0020 18455 Part, Plasma-Therm 790, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18455 PartApplied Materials
790Plasma-Therm
OEMApplied MaterialsPlasma-Therm
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18455 PartPlasma-Therm 790
Cited variants—
Specifications
ConfigurationShaft,Rf In Local Match, Hdpcvd,Rev3[2]—
Tool name—PECVD 1 (PlasmaTherm 790)[3]
System type—open-load etch and deposition systems[1]
Series reference—formerly Plasma-Therm 790+ series[1]
Process type—PECVD[3]
Category—Chemical Vapor Deposition (CVD)[3]
Archived series reference—formerly Plasma-Therm 790+ series open-load etch and deposition systems[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu