Waferpedia

Comparison ledger

0020 17485 PartversusEi 7 L E-Beam

Applied Materials 0020 17485 Part, Ulvac Ei 7 L E-Beam, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 17485 PartApplied Materials
OEMApplied MaterialsUlvac
CategoryDepositionDeposition
Wafer size—Auto loader (EFEM), wafer transfer system, load lock chamber, process chamber, operation panel.
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17485 PartUlvac Ei 7 L E-Beam
Specifications
ConfigurationStrap, RF Out 2 Balanced Coil Match, Hdp[1]Exhaust System:[2]
Wafer size—Auto loader (EFEM), wafer transfer system, load lock chamber, process chamber, operation panel.[2]
Evaporation Source—EGN-4020 (40 ml x 20 pockets)[2]
EB Power Supply—10 kw[2]
Internal jig—Rotation type[2]
Substrate holder—6 inch dia x 25 pcs[2]
Substrate heating—infrared heater unit (750W x 2), 200* C normal, 300* C max[2]
Deposition materials—Metals (Al, Ni, Ti, Pt, Au, etc.)[2]
Dry Pump—PS1802-AN_200V_60Hz[2]
Cryo Pump—CRYO-U20P[2]
Vintage—2015[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing