Waferpedia

Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusCM 700

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Hitachi CM 700, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
CM 700Hitachi
OEMApplied MaterialsHitachi
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedHitachi CM 700
Cited variants—
Specifications
ConfigurationRefurbished[2]parts machine[3]
Equipment type—Die Bonder[4]
Category—Packaging & Bonding[5]
Family models—CM 700, CM 700 H[1]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]Equipment inventory listing
  5. [5]waferpedia.comwaferpedia.com