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0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusFineplacer Lambda

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Finetech Fineplacer Lambda, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsFinetech
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedFinetech Fineplacer Lambda
Specifications
ConfigurationRefurbished[1]HDD and Software[2]
Placement accuracy—sub-micron[3]
Bonding force—500 N[2]
Bonding technologies—Thermocompression, ultrasonic/thermosonic, ACF bonding, UV cure, C4 chip bonding[4]
Vision alignment system—Dual-image overlay with stationary beam splitter[4]
Substrate size (max)—50 mm square[5]
Die size (min)—2–3 mm[5]
Substrate thickness range—0 to 10 mm[4]
Heated stage option—available[5]
Heated placement tool option—available[5]
Bonding technology—die bonding (as die bonder)[2]
Force option—500N Force[2]
Vision system—patented advanced Vision Alignment System[4]
Alignment principle—imaging two orthogonal images simultaneously into one common image plane[4]
System type—sub-micron bonding system[4]
Module interface—Finetech Module Interface (FMI)[4]
Mains voltage—Mains voltage out, max 10A load (fuse)[4]
Accessory optics—special optics for positioning large fine pitch devices, high magnification systems[4]
Maximum bonding force—500 N[2]
Interface—RS-232[4]
Vacuum—Built-in vacuum pump[4]
Adjustment set resolution—1 µm[4]
Maximum force—500N[2]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]epfl.chepfl.ch
  4. [4]manualslib.commanualslib.com
  5. [5]research.rice.eduresearch.rice.edu