Waferpedia

Comparison ledger

0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusEagle XP 5

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, ASM Eagle XP 5, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedASM Eagle
Specifications
ConfigurationRefurbished[1]PE-ALD System Mainframe[2]
Phase—3 Phase[3]
Full Load Amps—130 A[3]
Make—ASM[2]
Model—Eagle XP 5[2]
Description—Bonder[2]
Power—AC190-220V[3]
Frequency—50/60Hz[3]
Current—25 KA[2]
Control & software—with PC & software[2]
Software Version—Eagle I ASMJ software (Windows embedded XP / OS)[4]
Failure mode—Faulty throttle valve in 2nd chamber[2]
Vintage—2010[2]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]waferpedia.comwaferpedia.com