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0010-47763 ASSY ESC Bonded Monopolar Dual HeatedversusEagle Aero

Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, ASM Eagle Aero, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedASM Eagle Aero
Cited variants—
Specifications
ConfigurationRefurbished[2]Single phase[3]
Voltage—110 VAC[3]
Equipment Type—Automatic ball wire bonding system[4]
Bonding Technology—Thermosonic with X-Power[1]
Transducer—Aeroducer dual frequency (X and Y direction)[1]
Bonded Ball Size—22 µm[1]
Wire Size—0.5 mil[1]
UPH Improvement—Up to 30% for typical Cu wire application[1]
Wire Materials—Copper wire, gold wire and compatible materials[4]
Application—High-end IC semiconductor packaging[1]
Power Requirements—110 VAC, Single phase, 50/60Hz[3]
Optical System—Dual magnification optical path, dual-color coaxial light[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]semi.asmpt.comsemi.asmpt.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]wafer-equipment.comwafer-equipment.com
  5. [5]mono.ipros.commono.ipros.com