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0010-22161 High EFF RF Matchversus8 SE

Applied Materials 0010-22161 High EFF RF Match, Tokyo Electron 8 SE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
8 SETokyo Electron
OEMApplied MaterialsTokyo Electron
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchTokyo Electron 8 SE
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]8 SE[3]
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Configuration—High Temperature, Oxide[3]
OEM—Tokyo Electron[3]
Wafer size—8 inch[3]
System description—High Temperature, Oxide[3]
Temperature range / max—1200~1250*C[3]
Process—Wet Ox, can be used as Dry Ox[3]
Product family—TELFORMULA Alpha 303i / ATP Alpha 8-SE / ATP[4]
Footprint—Smallest footprint worldwide; 1100 mm wide[4]
Control—Equipped with proven ART (Adaptive Realtime Temperature) Control[4]
Productivity—High productivity powered by thermo plug[4]
Supported Wafer Size—8 inch[3]
Process Type—High Temperature Oxide, Wet Oxidation, Dry Oxidation[3]
Maximum Temperature Range—1200~1250 °C[3]
Product Series—ALPHA-303i series[4]
Machine Footprint Width—1100 mm[4]
Temperature Control—ART (Adaptive Realtime Temperature) Control[4]
Compliance—JG/SEMI Standards[4]
Temperature range—1200~1250°C[3]
Process type—High temperature oxide processing[3]
Oxidation type—Wet or dry oxidation[3]
Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org