Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Takatori ATM 8100 S, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | ATM 8100 STakatori |
|---|---|---|
| OEM | Applied Materials | Takatori |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Takatori ATM |
| Specifications | ||
| Make | Applied Materials[1] | — |
| Model | 0010-22161[1] | — |
| Description | HTESC PH 1 REV A[2] | — |
| Condition | Used[2] | — |
| Stock Number | BM6628[2] | — |
| Configuration | — | Non-operational[3] |
| Machine type | — | Automatic Wafer Mounter[4] |
| Application | — | Mounting wafers to dicing frames before the dicing process[4] |
| Throughput | — | 80 wafers/h[4] |
| Wafer size | — | 6 inch; 8 inch[4] |
| Frame size | — | 6 inch W 230mm; 8 inch W 300mm[4] |
| Tape width | — | 6 inch W 230mm; 8 inch W 300mm[4] |
| Utilities | — | AC200V single phase 50/60Hz; 3.0KVA; Pressure 0.5Mpa; 300Nl/min using venturi valve[4] |
| Dimensions | — | D 1,200 W 1,646 H 1,800mm[4] |
| Weight | — | 850kg[4] |
| Options | — | ID reader; Barcode labeller[4] |
| Feature | — | Mounting minimum 150-micron thick and max 5 mm-warped wafers[5] |
| Vintage | — | 1998 Vintage[6] |
| Power & electrical | — | AC200V single phase 50/60Hz; 3.0KVA; Pressure 0.5Mpa; 300Nl/min using venturi valve[6] |
| Mounting minimum | — | 150-micron thick and max 5 mm-warped wafers[5] |