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0010-22161 High EFF RF MatchversusGalaxy

Applied Materials 0010-22161 High EFF RF Match, Dek Galaxy, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsDek
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchDek Galaxy
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]—
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
Machine / Process Alignment Capability—2 Cpk @ +/- 12.5um, 6 Sigma[3]
Cycle Core Time—7 seconds[3]
Max. Board Size—610mm (X) x 508mm (Y)[3]
Print Speed—2mm to 300mm/sec[3]
Fiducial Recognition—Automatic fiducial teach and find incorporating 0.1mm fiducial capture[3]
Operating System—windows Embedded Software 7 or Win XP (RTC)[3]
Operator Interface—Colour TFT touch screen display, keyboard and trackball with DEK Instinctiv software[3]
Connectivity—RJ-45LAN (networking) and USB2 interface available[3]
Printer Construction—One piece optimized welded frame[3]
ISCAN Machine Control—Motion control using CAN BUS network[3]
Camera Positioning—High accuracy linear motors and encoders, with 1 micron resolution[3]
Machine Interface—Upline and downline FMI included[3]
Squeegee—Clamped double trailing edge squeegee (1 set included)[3]
Configuration—Auto stencil load (including drip tray[3]
Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]inventory listing