Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Besi 2200 EVO Multi-Chip, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | Besi 2200 |
| Cited variants | — |
|
| Specifications | ||
| Make | Applied Materials[2] | — |
| Model | 0010-22161[2] | 2200 EVO[4] |
| Description | HTESC PH 1 REV A[3] | — |
| Condition | Used[3] | — |
| Stock Number | BM6628[3] | — |
| Configuration | — | Dual head[4] |
| OEM | — | Besi / Datacon[4] |
| Equipment type | — | Multi-Chip Die Sorter[4] |
| Vintage | — | 2016[1] |