Comparison ledger
Applied Materials 0010-18024 Pyrometer Assembly, Applied Materials UVision SP 200 Brightfield Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-18024 Pyrometer AssemblyApplied Materials | UVision SP 200 Brightfield WaferApplied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | Tool scans a wafer in a meander path |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-18024 Pyrometer Assembly | Applied Materials UVision |
| Specifications | ||
| Configuration | Capable of working on Applied Materials Radiance[1] | 5 Wire[2] |
| Phase | — | 3 Phase[2] |
| Ligth source | — | Laser ( 266 ג =nm)[2] |
| Wafer size | — | Tool scans a wafer in a meander path[2] |
| Manufacturer | — | Applied Materials[2] |
| Model | — | UVision SP 200[2] |
| Tool type | — | Brightfield wafer inspection tool[2] |
| Category | — | Metrology & Inspection[3] |
| Wafer path | — | Tool scans a wafer in a meander path[3] |
| Power | — | 3 Phase[2] |
| Frequency | — | 50/60 Hz[2] |
| Light source | — | Laser (266 nm)[2] |
| Inspection capability | — | Designed to inspect pattern wafers, bare wafers, and unpatterned wafers[2] |
| Comparison capability | — | Die to Die and Cell to Cell comparison capability[2] |
| Detection mode | — | Can use reflected brightfield and scattered signal (greyfield) in parallel for detection[2] |
| Defect detection | — | On pattern wafers capable of detecting defects of 25 nm with 90% capture rate[2] |
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