Comparison ledger
Applied Materials 0010-16392 ESC Assembly, STS MXP Multiplex ICP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-16392 ESC AssemblyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | STS |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-16392 ESC Assembly | STS MXP Multiplex ICP |
| Specifications | ||
| OEM | Applied Materials[1] | STS[3] |
| Model | 0010-16392[1] | MXP Multiplex ICP[3] |
| Type | ESC Assembly[1] | — |
| Wafer Size | 300 mm[2] | — |
| Electrode Configuration | Dual[2] | — |
| Configuration | — | Plasma Etcher[3] |
| Tool type | — | Inductively coupled plasma etcher[4] |
| Category | — | Etch[5] |
| Process | — | Plasma etching[4] |
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