Comparison ledger
Applied Materials 0010-16392 ESC Assembly, Lam Research 2300 Exelan Flex Dielectric, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-16392 ESC AssemblyApplied Materials | 2300 Exelan Flex DielectricLam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-16392 ESC Assembly | Lam Research 2300 Exelan Flex Dielectric |
| Cited variants | — | |
| Specifications | ||
| OEM | Applied Materials[2] | — |
| Model | 0010-16392[2] | — |
| Type | ESC Assembly[2] | — |
| Wafer Size | 300 mm[3] | — |
| Electrode Configuration | Dual[3] | — |
| Wafer size | — | 300mm[4] |
| ICP source frequency | — | 13.56MHz for Exelan HP; 60MHz for Flex variant[1] |
| Max ICP power (HP variant) | — | 3000W[1] |
| Technology node | — | sub-65nm for Flex variant; 90nm for HP variant[1] |
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