Comparison ledger
Applied Materials 0010-13622 RF Match for, EV Group 150, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | 150EV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | EV Group 150 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[2] | Spin-on + spray-on module[3] |
| Model | 0010-13622[2] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[2] | — |
| Feature | High Efficiency HE RF Match-Bias[2] | — |
| Temperature | — | 1x hot plate 350°C[3] |
| Wafer sizes | — | 6 inch, 8 inch[3] |
| Wafer diameter | — | Up to 200 mm[1] |
| Process modules | — | Up to 4 wet process modules[1] |
| Bake/chill units | — | Up to 20[1] |
| Bake temperature | — | Up to 250 °C (optional up to 350 °C)[1] |
| Footprint | — | < 3 m²[1] |
| Placement accuracy | — | < 50 μm[1] |
| Resist viscosity support | — | Up to 52000 cP[1] |
| Stations | — | 2 stations (spin-on + spray-on)[3] |
| Hot plates | — | 5 hot plates (1 up to 350 °C)[3] |
| Chill plate | — | 1 chill plate[3] |
| Pumps | — | 2 Cybor pumps, 1 syringe pump, 1 high viscosity pump[3] |
| OmniSpray technology | — | Yes (ultrasonic atomization for conformal coating)[1] |
| EBR/BSR | — | Yes (edge bead removal, back-side rinse)[3] |
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